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Lithium Battery Xray Inspection Machine AX8300 Unicomp Internal Flaw Testing Equipment

คุณสมบัติพื้นฐาน
สถานที่กำเนิด: จีน
ชื่อแบรนด์: UNICOMP
การรับรอง: CE, FDA
หมายเลขรุ่น: AX8300
การซื้อขายอสังหาริมทรัพย์
ปริมาณการสั่งซื้อขั้นต่ำ: 1เซ็ต
ราคา: can negotiate
เงื่อนไขการชำระเงิน: ที/ที,แอล/C
ความสามารถในการจัดหา: 30 ชุดต่อเดือน
สรุปผลิตภัณฑ์
Lithium Battery X-ray Inspection Machine AX8300 The Unicomp AX8300 is a purpose-engineered offline micro-focus X-ray non-destructive testing system, specially optimized for high-precision quality control across PCBA, SMT assembly, semiconductor packaging and miniature electronic component manufactur...

รายละเอียดสินค้า

เน้น:

Lithium Battery Xray inspection machine

,

AX8300 internal flaw testing equipment

,

Unicomp X Ray Machine with warranty

Warranty: 1 ปี
Product Name: AX8300
Power Supply: 220V,50Hz/60Hz 4A
Weight: 1350กก
Dimension: 1215*1325*1700(มม.)
Voltage: 110kV
รายละเอียดสินค้า
Lithium Battery X-ray Inspection Machine AX8300
The Unicomp AX8300 is a purpose-engineered offline micro-focus X-ray non-destructive testing system, specially optimized for high-precision quality control across PCBA, SMT assembly, semiconductor packaging and miniature electronic component manufacturing.
Developed to fill the performance gap between mainstream 90kV and 130kV X-ray inspection equipment, it integrates Unicomp's proprietary self-developed 110kV sealed micro-focus X-ray source, delivering perfectly balanced penetration and contrast performance.
Key Features
  • 110kV Microfocus X-ray source
  • High resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt Motions (table, tube, FPD)
  • 360° Table Rotation
  • Angle View up to 70 Degrees
  • Point and Click Location Navigation
  • CNC Programming for Multiple Image Inspection Routines
  • Maximum Inspection Area: 360 x 340mm
Applications
  • BGA/CSP/FLIPS CHIP: Bridging, Voids, Opens, Excessive/Insufficient solder
  • QFN: Bridging, Voids, Opens, Registration
  • SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
  • Semiconductor: Bond wire, Die attach VOID, MOLD, VOID
  • Multi-layer Board (MLB): Inner layer registration, PAD stack, Blind/buried vias
Technical Specifications
Model AX8300
Max kV/Type 110 kV/Sealed
Power Consumption 900W
Max. Electron Beam Power 25W
Focal Spot Size 5μm
Geometric Magnification 48.8X
Imaging System (Option) Flat Panel Detector
Door Open Hand-operated door
Monitor 27" HD 4K Display
Dimensions 115x1325x1700mm
Weight 1350kg
Radiation Safety <1μSv/hr
Control Keyboard/Mouse/Joystick
Automated Inspection Standard
Primary Applications Chip inspection/Electronic components/Auto parts, etc.
Note: Focal spot size is variable. Please consult Unicomp for specific requirements.
X-ray Safety Commitment
All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed 0.5 millirem/hr at 2" from any external surface. Our machines typically emit 15 times less radiation.
Inspection Images
AX8300 X-ray inspection machine sample inspection image showing high-resolution PCB component analysis
เรตติ้งโดยรวม
5.0
★★★★★
★★★★★
จาก 50 รีวิวล่าสุด
5 ดาว
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4 ดาว
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3 ดาว
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รีวิวทั้งหมด
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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