Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary ...

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 44.7X Geometric magnification, high-definition real-time image. ● One-button operation with 2...

High Precision SMD X-Ray Chip Counter Unicomp CX7000L Advanced offline inspection system for SMD chips with high-speed, non-destructive counting capabilities. Technical Specifications Equipment Features Footprint (W*D*H) / Machine Weight 870 mm*1410 mm*1960 mm / 740 kg Package Plywood Case, 1050 cm...