pcb inspection system
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PCB BGA การตรวจสอบอุปกรณ์อิเล็กทรอนิกส์ X-Ray เครื่องลูกกอล์ฟภายในการตรวจสอบคุณภาพ
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
ไมโครโฟกัส AX9100 CNC Mapping Unicomp X Ray 130kV สำหรับเมนบอร์ด
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
ระบบการสร้างภาพรังสีเอ็กซ์ในโรงงานอุตสาหกรรม 80kV / 90kV แหล่งที่มาที่มีขนาดจุดโฟกัสเฉพาะของ Submicron
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size FEATURES: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x 380mm,
เครื่องถ่ายรังสีดิจิตอล & เครื่องถ่ายรังสี Unicomp AX7900 สําหรับการซ่อม PCB และ IC / BGA Ball Soldering Measurement & Testing
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
เครื่องตรวจสอบรังสีเอ็กซ์ความแรงสูง 90kV Unicomp AX7900 สําหรับการทดสอบความแม่นยําของคุณภาพ BGA
High quality 90kV X ray inspection machine Unicomp AX7900 for BGA quality accuracy testing Description of IC X Ray machine AX7900: It finds widespread application in industries like BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductors, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among various others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise
เครื่อง BGA Modern X Ray การรุกที่แข็งแกร่งสำหรับชิ้นส่วนไฟฟ้า
Electronic and electrical components Chinese BGA X-Ray Inspection Machine The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
เครื่องตรวจจับภาพเอ็กซ์เรย์ FPD 100KV AX8200 สำหรับ SMT BGA PCB FPC
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection Item Definition Specs System Parameters Size 1080(L
Unicomp 90kV 5um Closed Tube Electronics เครื่องเอ็กซ์เรย์สำหรับ SMT PCBA BGA
Unicomp 90kV 5um Closed Tube Electronics X Ray Machine For SMT PCBA BGA Unicomp 90kV 5um closed tube CX3000 X-ray Inspection System for SMT PCBA BGA QFN LED soldering void inspection Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution
ความแม่นยําสูง PTH ผ่านรู PCB ประกอบ X-ray AX7900 Unicomp ความมั่นคงสูง
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
