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Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell The Unicomp AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields diagram of Unicomp X-ray AX9100max Functions and Features Functions and features diagram of Unicomp X-ray AX9100max
เครื่องดันความดันด้วยโลหะอุตสาหกรรมเครื่อง X Ray, เครื่องเอ็กซ์เรย์ดิจิตอลรุ่น UNC320
Metal Pressure Vessel Industrial X Ray Machine Digital Detectors UNC320 The excellent image quality of the UNC320 system is based on the interplay of the digital flat-panel detector array with our Unicomp software. The technology provides exceptional detail detection, even though varying material thicknesses, and assists in visually determining the depth of casting flaws. Applications: Aerospace Automotive Foundries Science & Research Weld inspection 1. Accurate, fast, and
Unicomp AX8200MAX 5um microfocus X-Ray เครื่องสำหรับ EMS ยานยนต์ PCBA BGA QFN CSP บัดกรีข้อบกพร่องการตรวจสอบ
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
CSP SMT Electronics เครื่องเอ็กซ์เรย์ 110kV Unicomp AX8500 สำหรับ SMT PCBA BGA QFN
Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
เครื่องเอ็กซ์เรย์ SMT BGA Electronics FPD 1000X กำลังขยาย Unicomp AX8500
Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel
UNX6030N Unicomp X Ray Machine Diode Array ความละเอียด 0.4 มม. สำหรับการตรวจสอบการปนเปื้อนในอาหาร
Unicomp Factory Supply X Ray Machine UNX6030N for Food contamination check Applications of Food Xray UNX6030N UNX6030-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of Food Xray UNX6030N Easy to Operate: one button start & stop, optional default product Provide High
เครื่อง Unicomp X Ray แบบเรียลไทม์ AX8200MAX 5 ไมครอนปิดท่อสำหรับ SMT EMS BGA Void Check
Real-time X-Ray machine Unicomp AX8200MAX with 5 micron closed tube for SMT EMS BGA void check Application Fields of BGA Xray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD
Unicomp UNX4015N เครื่องเอ็กซเรย์อาหารสำหรับผลิตภัณฑ์ธัญพืชลูกกวาดปลาสด
Food contamination X-Ray machine of Unicomp UNX4015N for fresh meet fish confectionery grain product Application of UNX4015N UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of UNX4015N Easy to Operate: one button start&stop, optional default product Provide
