electronics x ray system
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ระบบเอ็กซ์เรย์ไมโครโฟกัสอิเล็กทรอนิคส์ไมโครอิเล็กทรอนิกส์ SMT การควบคุมข้อบกพร่องภายใน
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
อัลกอริทึม FPD Electronics X Ray Machine 1.0kW สำหรับ LED Reflow Solder
Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
ระบบเอ็กซ์เรย์อิเล็กทรอนิกกำลังขยายสูงสำหรับ BGA CSP / QFN / PoP การตรวจสอบโมฆะ
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
ซีเอ็นซีโปรแกรมอิเล็กทรอนิคส์การตรวจจับโปรแกรมเอ็กซ์เรย์เครื่องลูกกอล์ฟการตรวจสอบคุณภาพภายใน
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
เครื่องมัลติฟังก์ชั่นอิเล็กทรอนิกส์ X-Ray ความเร็วสูงแบบเรียลไทม์สำหรับลูกทองคำ
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
PCB BGA การตรวจสอบอุปกรณ์อิเล็กทรอนิกส์ X-Ray เครื่องลูกกอล์ฟภายในการตรวจสอบคุณภาพ
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
LCD Monitor Capacitor Electronic X Ray Scanner Machine 24 "High Precision
High Precision X Ray Machine 24" LCD Monitor Capacitor Inspection Application Function & Features Large Size Inspection Table Laser Locator for Precise Location 24’’ FHD Interactive Touch LCD Display Fingerprint Access Management System Real-time Monitoring of Radiation Accurate Control, CNC ProgrammingAutomatic Positioning FPD 60° Tilting Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small
การตรวจสอบอัตโนมัติแบบ CNC ที่สามารถเขียนโปรแกรมได้ เครื่อง X-ray อิเล็กทรอนิกส์ AX9100MAX ที่มีมุมเลี้ยว 60° สําหรับวัดความโค้งของ IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
AX9100max เครื่องฉาก X ของอิเล็กทรอนิกส์ พร้อมการติดตามจุดคงที่ระหว่าง FPD หัน
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
