bga x ray machine
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ระบบรังสีเอ็กซ์ AX9100max พร้อมอัลการิธม์สําหรับการสร้างภาพแบบความละเอียดสูง
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
ระบบเอ็กซเรย์ตรวจสอบสิ่งปลอมปนด้วยไมโครโฟกัส CX3000 แบบตั้งโต๊ะสำหรับชิ้นส่วนอิเล็กทรอนิกส์การตรวจสอบปลอม
Desk-top Multi-function microfocus CX3000 X-ray Inspection System for electronic components fake inspection Specification Of X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x
90KV 5um microfocus closed tube X-ray ตรวจสอบระบบที่มีความละเอียดสูง FPD สำหรับ PCBA บัดกรีเป็นโมฆะ Defects checki
90KV 5um microfocus closed tube X-ray Inspection System with high resolution FPD for PCBA soldering void Defects checki Application Fields of X-ray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD
SMT Chipset Resistance อุปกรณ์ตรวจสอบอิเล็กทรอนิกส์ AX8200 X-Ray Closed 5g
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Unicomp รังสีเอ็กซ์ AX9100vs ระบบตรวจสอบ 3 มิตรโฟกัสรังสีเอ็กซ์วิเคราะห์
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
Unicomp รังสีเอ็กซ์ AX8300VS ระบบตรวจสอบ 3d มูลติโมด มิโครโฟกัส รังสีเอ็กซ์วิเคราะห์
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
อุปกรณ์ตรวจฉากรังสี Unicomp AX8300 Plus Semiconductor Microfocus
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
ความแม่นยําสูง PTH ผ่านรู PCB ประกอบ X-ray AX7900 Unicomp ความมั่นคงสูง
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
