bga x ray inspection system
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90KV Micron Focus Spot Size Tube X-Ray Machine Unicomp รุ่นที่ปรับปรุงขึ้น AX7900 พร้อมคอมพิวเตอร์คู่ เพื่อตรวจสอบคุณภาพโทรศัพท์มือถือ
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
เครื่องเอกซเรย์ Unicomp AX9100max 220AC 50Hz สำหรับการปีนดีบุก
Unicomp AX9100max X-ray Machine For Tin Climbing The Unicomp AX9100max X-ray Machine is specifically designed for tin climbing applications, offering advanced inspection capabilities for various industries. Application Fields Widely applied for: BGA, CSP, Flip Chip LED, Fuse, Diode PCB, Semiconductor Battery Industry Small Metal Casting Electronic Connector Module Cables Photovoltaic Industry Application fields of Unicomp X-ray AX9100max Functions and Features Functions and
ระบบ X-ray Unicomp AX9100max สําหรับการตรวจสอบความบกพร่องภายในของอะไหล่อิเล็กทรอนิกส์
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
การตรวจสอบอัตโนมัติแบบ CNC ที่สามารถเขียนโปรแกรมได้ เครื่อง X-ray อิเล็กทรอนิกส์ AX9100MAX ที่มีมุมเลี้ยว 60° สําหรับวัดความโค้งของ IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
เครื่องฉาก X PCB ขยายสูง Unicomp AX9100MAX สําหรับเครื่องอิเล็กทรอนิกส์ IC องค์ประกอบการตรวจสอบสายผูก
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
การตรวจสอบแบตเตอรี่ลิเดียม ด้วยท่อเอ็กซ์เรย์ไมโครโฟกัสจีน
Unicomp 130kV Microfocus X Ray Source For EMS SMT PCBA BGA QFN X Ray Machine UNMS-U130B is a closed tube 130 kV Microfocus X-Ray Source using hot cathode technology, digital control and 100% domestic raw materials. It has the advantages of small focal spot size, high magnification, stable X-Ray emission, higher output power and strong penetration ability. The high voltage, control circuit and cooling unit are properly arranged within a compact space, with 24V DC power supply
เครื่องฉาก X PCB ขยายสูง Unicomp AX9100MAX สําหรับเครื่องอิเล็กทรอนิกส์ IC องค์ประกอบการตรวจสอบสายผูก
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
เครื่องเอ็กซ์เรย์ Unicomp AX9100max 130kV 65W สำหรับตรวจสอบ IGBT
Unicomp AX9100max X-ray Machine For IGBT The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
PCBA 22 "LCD 1kW NDT Electronics X Ray Machine
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function workstation with
