bga x ray inspection system
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เครื่องกำเนิดไฟฟ้าแบบรวม SMT / EMS X Ray พร้อมด้วยระบบการถ่ายภาพความละเอียดสูง
Metal X Ray Machine with integrated generator & a high-resolution imaging chain The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
Unicomp AX8200MAX 5um microfocus X-Ray เครื่องสำหรับ EMS ยานยนต์ PCBA BGA QFN CSP บัดกรีข้อบกพร่องการตรวจสอบ
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
เครื่องซีเอ็นซี 1.0 กิโลวัตต์โปรแกรม X Ray สำหรับแพ็คเกจ SMT BGA QFP PoP
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
0.8kW 5um FDA Electronics X Ray Machine สำหรับ SMT BGA Soldering
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
เครื่องตรวจจับภาพเอ็กซ์เรย์ FPD 100KV AX8200 สำหรับ SMT BGA PCB FPC
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection Item Definition Specs System Parameters Size 1080(L
เครื่อง X-ray ในเวลาจริง กับ 5 มิกรออน โฟกัส ท่อ X-ray สําหรับ BGA การตรวจสอบลูกผสม
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Finefocus Tube 100KV X Ray Scanner AX8200 สำหรับการตรวจสอบ PCBA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
ระบบเอ็กซเรย์รังสีเอกซ์ Unicomp AX8200max สำหรับการตรวจสอบข้อบกพร่องภายในของชิ้นส่วนอิเล็กทรอนิกส์
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector
AX8200max เครื่องฉาก X PCB 90kV ด้วยฟังก์ชันการชัน ± 60 ° เพื่อผลการตรวจ
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Application Fields of SMT X-Ray machine Unicomp AX8200MAX BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive
