bga x ray inspection system
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การตรวจสอบเอ็กซเรย์ 2.5D/3D ความแม่นยำสูงสำหรับการตรวจจับข้อบกพร่อง BGA และ PCBA UNICOMP AX8300
High-Precision 2.5D/3D X-ray Inspection for BGA & PCBA Defect Detection UNICOMP AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In ...
ชิ้นส่วนอิเล็กทรอนิกส์ BGA X Ray Inspection Machine
Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more ...
เซมิคอนดักเตอร์ BGA Flip Chip Inspection X-ray AX8300 UNICOMP การควบคุมการเข้าถึงด้วยลายนิ้วมือ
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
ระบบตรวจสอบรังสีอัลตราไวโอเลตมาเธอร์บอร์ดพร้อมพื้นที่ตรวจสอบขนาดใหญ่พิเศษ
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, ...
เครื่องตรวจสอบรังสี BGA X Ray แบบสแตนด์อโลนระบบประมวลผลภาพ DXI 65W
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and ...
เซมิคอนดักเตอร์ BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP ความละเอียดขั้นต่ำ5μm
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...
PCBA บัดกรี BGA X Ray เครื่องตรวจสอบด้วยความเร็วสูงพร้อมตารางตัวอย่างขนาดใหญ่
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area 645*670mm, max. inspection area ...
ระบบการตรวจสอบเซมิคอนดักเตอร์ SMT Bga X Ray สำหรับการตรวจจับข้อบกพร่องภายใน
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
100kV PCBA X Ray ระบบตรวจสอบ Unicomp Electronics สำหรับ BGA Void / การบัดกรี
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification ...
