bga inspection equipment
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Unicomp microfocus 2.5D เครื่องเอ็กซเรย์ตรวจสอบสิ่งปลอมปน AX7900 พร้อมมุมมองเฉียงสำหรับการตรวจสอบรอยร้าวของสายรัดและสายเคเบิล
Unicomp microfocus 2.5D X-ray inspection machine AX7900 with oblique view for Wire harness & cables cracks inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines
CSP AX8200 เครื่องเอ็กซ์เรย์อิเล็กทรอนิกส์ 100KV สำหรับการบัดกรีเซลล์แสงอาทิตย์
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
80KV/90KV อิเล็กทรอนิกส์ เครื่องฉาย X ที่ตั้งแม่นยํา เครื่องตรวจจับเลเซอร์สําหรับการตรวจสอบความบกพร่องภายในชิป
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
อลูมิเนียมหล่อตาย SMT / EMS X Ray Machine การตรวจจับโปรแกรม CNC สำหรับช่องว่าง BGA
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
ระบบเอ็กซ์เรย์ไมโครโฟกัสอิเล็กทรอนิคส์ไมโครอิเล็กทรอนิกส์ SMT การควบคุมข้อบกพร่องภายใน
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
2.5D Titling Electronics X Ray Machine การหมุน 40W 360 °พร้อมการเคลื่อนไหวแบบ 6 แกน
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point positioning system 130kV (Option 110KV) 7µm closed X-ray tube,
เครื่องมัลติฟังก์ชั่นอิเล็กทรอนิกส์ X-Ray ความเร็วสูงแบบเรียลไทม์สำหรับลูกทองคำ
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
กล้อง HD Unicomp X Ray 130kV สำหรับตรวจสอบบอร์ด PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
Unicomp AX9100 การวัดอัตโนมัติด้วยการเขียนโปรแกรม CNC อุปกรณ์ X-Ray สำหรับคุณภาพการบัดกรีแบบรีโฟลว์ PCBA BGA CSP QFN
Unicomp AX9100 Automatic measurement with CNC programming X-Ray equipment for PCBA BGA CSP QFN reflow soldering quality Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube.● High speed & Millions pixels high resolution FPD.● 1000X magnification, high-definition real-time image.● One-button operation with 2.5D image display.● Off-line programming function, navigation mode detection.● 7 axis linkage, 70 degree tilt detection.Applications of Unicomp AX9100: ● SMT, BGA, CSP,
